General information
Type CPU / Microprocessor
Family Intel Core i3 Mobile
Model number ? I3-350M
CPU part number CN80617004161AC (SLBPL)
Frequency (MHz) ? 2267
Clock multiplier ? 17
Package 1288-ball micro-FCBGA
Size 1.34" x 1.1" / 3.4cm x 2.8cm
Introduction date January 7, 2010

Architecture / Microarchitecture
Processor core Arrandale
Core stepping C2 (SLBPL)
Manufacturing process 0.032 micron
382 million transistors (CPU die)
177 million transistors (IMC / graphics die)
Die size 81 (CPU die)
114 (IMC / graphics die) mm2

Data width 64 bit
Number of cores 2
Floating Point Unit Integrated
Level 1 cache size ? 2 x 32 KB instruction caches
2 x 32 KB data caches
Level 2 cache size ? 2 x 256 KB
Level 3 cache size Shared 3 MB
Multiprocessing Not supported
Features MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1 ?
SSE4.2 ?
EM64T technology ?
Hyper-Threading technology
Virtualization technology
Execute Disable bit ?

Low power features Thread C1, C3 and C6 states
Core C1/C1E, C3 and C6 states
Package C1/C1E, C3 and C6 states
Enhanced SpeedStep technology ?

On-chip peripherals Integrated dual-channel DDR3 SDRAM Memory controller
Direct Media Interface
Integrated HD graphics controller


Electrical/Thermal parameters
V core (V) ? 0.8 - 1.4 (High Frequency mode)
0.775 - 1 (Low Frequency mode)
Minimum/Maximum operating temperature (°C) ? 0 - 105
Maximum power dissipation (W) ? 67.2 (peak, CPU core only)
44.8 (sustained, CPU core only)
Thermal Design Power (W) ? 35 (Package)
25 (CPU core)
12.5 (Graphics core)

Notes on Intel CN80617004161AC
Graphics and memory controllers are located on a separate die, which is manufactured on 0.045 micron technology
Integrated graphics controller runs at 500 MHz
Memory controller supports DDR3-800 and DDR3-1066 memory