Kohesi Bond KB 1039 CRLP is a two component, heat curing epoxy
system suitable for bonding, sealing, coating, potting and
encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio
by weight. This unique epoxy system offers remarkable adhesion to
a variety of substrates, such as metals, composites, glass,
ceramics, most plastics and rubbers. It offers a long working life at
room temperature of over 4 – 5 hours and cures quickly at elevated
temperatures. The optimal cure schedule is a room temperature
set-up followed by a heat cure at 90°C for 3 – 5 hours.

KB 1039 CRLP is specially formulated for use in cryogenic
applications. It offers phenomenal resistance to cryogenic shocks
and cycles down to 4K. Additionally it is optically clear and it is
capable of passing NASA standards for low outgassing (ASTM E-
595). This superior adhesive fosters outstanding physical strength
properties. It offers very low shrinkage upon cure and excellent flow
properties. In addition to superior electrical insulation, it also offers
very good chemical resistance. This product offers first-rate optical
clarity and cures rigid. KB 1039 CRLP is widely used in optical,
optoelectronic, electronics and aerospace industries, where optical
clarity, low outgassing and cryogenic serviceability are key
requirements.

PRODUCT HIGHLIGHTS
Superior optical clarity
Very good flow properties
Withstands cryogenic shocks and cycling
Outstanding mechanical strength properties
Excellent electrical insulation properties
Capable of passing NASA low outgassing

TYPICAL APPLICATIONS
Bonding
Sealing
Coating
Potting
Encapsulation

Industrial Certification : RoHS Compliant and NASA (Low
Outgassing ASTM E-595)

Packaging : Cans, Pails, Syringes