Kohesi Bond KB 10473 FL is a two component, room temperature curing
epoxy system suitable for bonding, sealing, potting and encapsulation. It
has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique
epoxy system offers remarkable flexibility and peel strength. It readily
cures at room temperature and can achieve faster cures at elevated
temperatures. The optimal cure schedule is an overnight room
temperature
set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.

KB 10473 FL is optically clear and offers top notch light transmissions
properties. It has a refractive index of 1.51. It offers an extensive
serviceable temperature range of 4K (-269.15°C) to +120°C. This
phenomenal adhesive fosters outstanding resistance to mechanical and
thermal shocks, even at cryogenic temperatures. It offers minimal
shrinkage upon cure. KB 10473 FL adheres well to a wide variety of
substrates including metals, ceramics, most plastics and glass. In
addition
to superior electrical insulation, it also offers lower exotherm, making it
ideal for stress free bonding. Part A and Part B are clear in color. KB
10473
FL is widely used in optical, optoelectronic, fiber-optic, electronics and
related industries especially where optical clarity, cryogenic serviceability
and high flexibility are desired.

PRODUCT HIGHLIGHTS
Superior optical clarity
Excellent flow properties
Phenomenal flexibility
Very low exotherm
ideal for casting
Exceptional electrical insulation properties
Resists mechanical and thermal shocks

TYPICAL APPLICATIONS
Bonding
Sealing
Coating
Potting
Encapsulation

Industrial Certification : RoHS Compliant

Packaging : Cans, Pails, Syringes, Gun Applicator