Kohesi Bond KB 1151 S-1 is a two component, room temperature curing
epoxy system suitable for bonding, sealing, coating, potting and
encapsulation. It has a favorable 100:30 (Part A: Part B) mix ratio by
weight. This unique epoxy system offers remarkable adhesion to a variety
of substrates, such as metals, composites, glass, ceramics, most plastics
and rubbers. It readily cures at room temperature and can achieve faster
cures at elevated temperatures. The optimal cure schedule is an
overnight
room temperature set-up followed by a heat cure at 70°C – 90°C for 3 –
5
hours.

KB 1151 S-1 is uniquely formulated for protection against harsh
chemicals,
especially fuels and solvents. Additionally, it contains no solvents or
diluents, making it a 100% reactive system. It offers an extensive
serviceable temperature range of -50°C to +150°C. This superior
adhesive
fosters outstanding physical strength properties. It offers very low
shrinkage upon cure and excellent flow properties. In addition, it has
superior electrical insulation properties. Part A is clear, whereas Part B is
amber clear in clear. This product can be formulated in a non-drip
viscosity
as well. KB 1151 S-1 is widely used in electronic, aerospace, chemical
processing and specialty OEM applications where resistance to solvents
and
fuels is critical.

PRODUCT HIGHLIGHTS
Superior chemical resistance
Very good flow properties
Protects against fuels and solvents
Outstanding mechanical strength properties
Excellent electrical insulation properties
Contains no solvent; 100% reactive

TYPICAL APPLICATIONS
Bonding
Sealing
Coating
Potting
Encapsulation

Industrial Certification : RoHS Compliant

Packaging : Cans, Pails, Syringes