Kohesi Bond KB 1452 HT-2AO is an exclusive two component epoxy
system
suitable for bonding, sealing, coating, potting and encapsulation
applications. It has a favorable 100:40 (Part A: Part B) mix ratio by
weight.
Remarkably, it offers excellent thermal conductivity and an extremely low
coefficient of thermal expansion (CTE). The optimal cure schedule is an
overnight room temperature set-up followed by a heat cure at 70°C –
90°C
for 3 – 5 hours. However, speedy cures are achievable with a straight
heat
cure as well at elevated temperatures.

KB 1452 HT-2AO offers an extensive serviceable temperature range of
-70°C to +200°C. It is a phenomenal adhesive that offers outstanding
physical strength properties and dimensional stability. KB 1452 HT-2AO
adheres well to a wide variety of substrates including metals, ceramics,
most plastics and glass. In addition to superior electrical insulation, it also
offers astounding chemical resistance to a variety of organic and
inorganic
acids, solvents, alkalis, aromatic hydrocarbons, oils and water. Part A has
a
gray color and Part B has an off-white color. Owing to its high thermal
conductivity and very low CTE, KB 1452 HT-2AO is widely used in
medical,
electronics, aerospace, optical, semiconductor and various OEM
applications requiring effective heat transfer capabilities.

PRODUCT HIGHLIGHTS
Very high thermal conductivity
Low coefficient of thermal expansion
Castable up to 3 inches depth
Outstanding chemical resistance
Exceptional electrical insulation properties
Very good flowability

TYPICAL APPLICATIONS
Bonding
Sealing
Coating
Encapsulation
Potting

Industrial Certification : RoHS Compliant

Packaging : Cans, Pails