Kohesi Bond TUF 1452 HT-2 is a two component, room temperature
curing
epoxy system suitable for bonding, sealing, potting and encapsulation. It
has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50
(Part
A: Part B) mix ratio by volume. This unique epoxy system offers
remarkable adhesion to wide variety of substrates including metals,
ceramics, most plastics and glass. It readily cures at room temperature
and can achieve faster cures at elevated temperatures. The optimal cure
schedule is an overnight room temperature set-up followed by a heat
cure
at 70°C – 90°C for 3 – 5 hours.

TUF 1452 HT-2 is a toughened system, offering low exotherm and a long
working life. It can withstand multiple cycles of thermal and mechanical
shocks. It offers an extensive serviceable temperature range of -60°C to
+220°C. This phenomenal adhesive fosters outstanding physical strength
properties as well as dimensional stability. It offers minimal shrinkage
upon
cure and is suitable for medium sized castings. In addition to superior
electrical insulation, it also offers astounding chemical resistance to a
variety of acids, bases, solvents, fuels, oils and water. Part A has a tan-
brown color and Part B has an amber color. TUF 1452 HT-2 is widely used
in the electronics, aerospace and various OEM applications.

PRODUCT HIGHLIGHTS
High glass transition temperature
Resists thermal and mechanical shocks
Very good flow properties
Superior chemical resistance
Exceptional electrical insulation properties
Phenomenal toughness

TYPICAL APPLICATIONS
Bonding
Sealing
Coating
Potting
Encapsulation

Industrial Certification : RoHS Compliant

Packaging : Cans, Pails, Syringes, Gun Applicator