Kohesi Bond KB 1031 ATFL-N is a two component, highly flexibilized,
nickel
filled epoxy system suitable for bonding and sealing. It has a convenient
1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very
good electrical conductivity and a first-rate peel strength. This epoxy
system readily cures at room temperature and can achieve faster cures at
elevated temperatures. The optimal cure schedule is an overnight room
temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5
hours.

KB 1031 ATFL-N can withstand severe thermal cycling and shocks even at
cryogenic temperatures. It offers an extensive serviceable temperature
range of 4K (-269.15°C) to +120°C. It is an outstanding adhesive that
offers superb physical strength properties and elongation, allowing it to
bond dissimilar substrates with different coefficients of thermal
expansion.
KB 1031 ATFL-N adheres well to a wide variety of substrates including
metals, ceramics, most plastics and glass. In addition to superior
electrical
and thermal conductivity, it also offers astounding chemical resistance to
a
variety of fuels, oils and water. Part A and Part B have a nickel color.
Owing to its versatile performance, KB 1031 ATFL-N is widely used in
electronics, aerospace, electrical, semiconductor, microwave and various
OEM applications.

PRODUCT HIGHLIGHTS
Easy mix ratio of 1:1 by weight or volume
Outstanding flexibility
Superior thermal conductivity
High peel strength
Nickel filled
electrically conductive
Cryogenically serviceable

TYPICAL APPLICATIONS
Bonding
Sealing

Industrial Certification : RoHS Compliant

Packaging : Cans, Jar