Kohesi Bond KB 1040 QF is a two component, room temperature
curing epoxy system suitable for bonding, sealing, coating, potting
and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio
by weight. This unique quartz filled epoxy system offers remarkable
adhesion to a variety of substrates, such as metals, composites,
glass, ceramics, most plastics and rubbers. It readily cures at room
temperature and can achieve faster cures at elevated temperatures.
The optimal cure schedule is an overnight room temperature set-up
followed by a heat cure at 70°C – 90°C for 2 – 3 hours.

KB 1040 QF being quartz filled, offers phenomenal dimensional
stability and low coefficient of thermal expansion (CTE).
Additionally, it is capable of passing NASA standards for low
outgassing (ASTM E-595) test. It offers an extensive serviceable
temperature range of -50°C to +120°C. This superior adhesive
fosters outstanding physical strength properties and offers very low
shrinkage upon cure. It offers very good flow properties. In addition
to superior electrical insulation, it also offers astounding chemical
resistance to a variety of fuels, oils, acids, bases and water. Part A
and Part B are beige in color. KB 1040 QF is widely used in optical,
optoelectronic, fiber-optic, electronics, aerospace and related
industries.

PRODUCT HIGHLIGHTS
Exceptionally low shrinkage post curing
Capable of passing NASA low outgassing
Superior dimensional stability
Outstanding mechanical strength properties
Very good electrical insulation properties
Excellent flow properties

TYPICAL APPLICATIONS
Bonding
Sealing
Coating
Potting
Encapsulation

Industrial Certification : RoHS Compliant and NASA (Low
Outgassing ASTM E-595)

Packaging : Cans,Pails