Kohesi Bond KB 1039 CRLP-AO is a two component, heat curing epoxy
system suitable for bonding, sealing, coating, potting and encapsulation.
It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This
unique epoxy system offers remarkable adhesion to a variety of
substrates, such as metals, composites, glass, ceramics, most plastics
and rubbers. It offers a long working life at room temperature of over 4 –
5 hours and cures quickly at elevated temperatures. The optimal cure
schedule is a room temperature set-up followed by a heat cure at 90°C
for 3 – 5 hours.

KB 1039 CRLP-AO is specially formulated for use in cryogenic
applications. It offers phenomenal resistance to cryogenic shocks and
cycles down to 4K. Additionally it is thermally conductive and it is capable
of passing NASA standards for low outgassing (ASTM E-595). This
superior adhesive fosters outstanding physical strength properties. It
offers very low shrinkage upon cure and excellent flow properties. In
addition to superior electrical insulation, it also offers very good chemical
resistance. Part A is black and Part B is off white in color. KB 1039 CRLP-
AO is widely used in applications where thermal conductivity, low
outgassing and cryogenic serviceability are key requirements.

PRODUCT HIGHLIGHTS
Superior thermal conductivity
Very good flow properties
Withstands cryogenic shocks and cycling
Outstanding mechanical strength properties
Excellent electrical insulation properties
Capable of passing NASA low outgassing

TYPICAL APPLICATIONS
Bonding
Sealing
Coating
Potting
Encapsulation

Industrial Certification : RoHS Compliant and NASA (Low Outgassing
ASTM E-595)

Packaging : Cans, Pails