Kohesi Bond KB 1031 AT-2LO is a two component, highly flexibilized
epoxy system suitable for bonding, sealing, potting and encapsulation. It
has a favorable 1:3 (Part A: Part B) mix ratio by weight. Remarkably, it
offers stellar thermal conductivity and is capable of passing NASA low
outgassing test, unlike most flexible epoxies. This epoxy system readily
cures at room temperature and can achieve faster cures at elevated
temperatures. The optimal cure schedule is an overnight room
temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5
hours.

KB 1031 AT-2LO can withstand severe thermal shocks and cycling even
at cryogenic temperatures. It offers an extensive serviceable temperature
range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that
fosters outstanding physical strength properties and yet consolidates high
peel strength and elongation. KB 1031 AT-2LO adheres well to a wide
variety of substrates including metals, ceramics, most plastics and glass.
In addition to superior electrical insulation, and thermal conductivity, it
also offers astounding chemical resistance to a variety of fuels, oils and
water. Part A has a gray color and Part B has an off-white color. Owing to
its remarkable performance and vacuum compatibility KB 1031 AT-2LO is
widely used in electronics and related industries.

PRODUCT HIGHLIGHTS
Superior thermal conductivity
Tremendous flexibility and elongation
Cryogenically serviceable
Soaring peel strength
Exceptional electrical insulation properties
Capable of passing NASA low outgassing

TYPICAL APPLICATIONS
Bonding
Sealing
Coating
Potting
Encapsulation

Industrial Certification : RoHS Compliant and NASA (Low Outgassing
ASTM E-595)

Packaging : Cans, Pails