Kohesi Bond KB 1040 AN-1 is a two component, room temperature curing
epoxy system suitable for bonding, sealing, potting and encapsulation. It
has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it
offers stellar thermal conductivity and is capable of passing NASA low
outgassing test. Its stellar heat transfer capabilities and flow
characteristics
make it fitting for potting applications. This epoxy system readily cures at
room temperature and can achieve faster cures at elevated
temperatures.
The optimal cure schedule is an overnight room temperature set-up
followed by a heat cure at 70°C – 90°C for 3 – 5 hours.

KB 1040 AN-1 can withstand severe thermal cycling and provides
superior
physical strength properties and dimensional stability. It offers an
extensive serviceable temperature range of -50°C to +120°C. KB 1040
AN-
1 adheres well to a wide variety of substrates including metals, ceramics,
most plastics and glass. In addition to superior electrical insulation, and
thermal conductivity, it also offers astounding chemical resistance to a
variety of fuels, oils and water. Part A has a gray color and Part B has a
clear color. Owing to its remarkable performance and vacuum
compatibility
KB 1040 AN-1 is widely used in aerospace, electronics and related
industries.

PRODUCT HIGHLIGHTS
Superior thermal conductivity
Very low coefficient of thermal expansion
Phenomenal dimensional stability
Excellent flow properties
Outstanding electrical insulation properties
Capable of passing NASA low outgassing

TYPICAL APPLICATIONS
Bonding
Sealing
Coating
Potting
Encapsulation

Industrial Certification : RoHS Compliant and NASA (Low Outgassing
ASTM
E-595)

Packaging : Cans, Pails