Kohesi Bond KB 10473 FLAO is a two component, room temperature
curing epoxy
system suitable for bonding, sealing, potting and encapsulation. It has a
convenient
1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers
remarkable flexibility and peel strength. It readily cures at room
temperature and
can achieve faster cures at elevated temperatures. The optimal cure
schedule is an
overnight room temperature set-up followed by a heat cure at 70°C –
90°C for 3 – 5
hours.

KB 10473 FLAO is thermally conductive and offers top notch conductivity
of 1.4 –
1.5 W/m/K. It is cryogenically serviceable and offers an extensive
serviceable
temperature range of 4K (-269.15°C) to +120°C. This phenomenal
adhesive fosters
outstanding resistance to mechanical and thermal shocks. It offers
minimal
shrinkage upon cure. KB 10473 FLAO adheres well to a wide variety of
substrates
including metals, ceramics, most plastics and glass. In addition to
superior electrical
insulation, it also offers lower exotherm, making it ideal for stress free
bonding. Part
A and Part B are off-white in color. KB 10473 FLAO is widely used in
optical,
optoelectronic, fiber-optic, electronics and related industries especially
where
excellent thermal conductivity, cryogenic serviceability and high flexibility
are
desired.

PRODUCT HIGHLIGHTS
Superior thermal conductivity
Excellent flow properties
Phenomenal flexibility
Very low exotherm
ideal for casting
Exceptional electrical insulation properties
Capable of passing NASA low outgassing

TYPICAL APPLICATIONS
Bonding
Sealing
Coating
Potting
Encapsulation

Industrial Certification : RoHS Compliant

Packaging : Cans, Pails