Kohesi Bond KB 1631 HTC-1 is a two component epoxy system suitable
for
bonding and sealing. It has a 100:60 (Part A: Part B) mix ratio by weight.
Most importantly, it offers stellar thermal conductivity and is capable of
passing NASA low outgassing test. This epoxy system readily cures at
room
temperature and can achieve faster cures at elevated temperatures. The
optimal cure schedule is an overnight room temperature set-up followed
by
a heat cure at 70°C – 90°C for 3 – 5 hours.

KB 1631 HTC-1 can withstand severe thermal shocks and cycling even at
cryogenic temperatures. It offers an extensive serviceable temperature
range of 4K (-269.15°C) to +200°C. It is a phenomenal adhesive that
fosters outstanding physical strength properties and low coefficient of
thermal expansion (CTE). KB 1631 HTC-1 adheres well to a wide variety
of
substrates including metals, ceramics, most plastics and glass. In
addition
to superior electrical insulation, dimensional stability and thermal
conductivity, KB 1631 HTC-1 also offers astounding chemical resistance
to
a variety of acids, bases, fuels, oils and water. Part A and Part B have an
off-white color. Owing to its remarkable performance and vacuum
compatibility KB 1631 HTC-1 is widely used in electronics, semiconductor,
cryogenic and major OEM applications.

PRODUCT HIGHLIGHTS
Superior thermal conductivity
Low coefficient of thermal expansion (CTE)
Thixotropic Paste
Superior dimensional stability
Exceptional electrical insulation properties
Capable of passing NASA low outgassing

TYPICAL APPLICATIONS
Bonding
Sealing

Industrial Certification : RoHS Compliant and NASA (Low Outgassing
ASTM
E-595)

Packaging : Cans, Pails