Kohesi Bond KB 1458 TC is a one-of-a-kind, two component, thermal
management epoxy system. Firstly, this product offers phenomenal heat
transfer capabilities. This products has very low thermal resistance and
can
be applied in layers as thin as 10 microns. The efficiency of heat transfer
improves exceedingly with lower thermal resistance. This can be
explained
easily with the following formula:

R = l/K [“R” is the thermal resistance; “l” is the adhesive layer thickness;
“K” is the thermal conductivity of the adhesive]

Applying peculiar values, standard thermally conductive adhesives
(alumina filled) that are applicable in more than 50 micron thicknesses,
offer a thermal resistance of 35 – 40 × 10-6 m2·K/W. Since KB 1458 TC
can be applied in 10 micron thick sections, it offers a notably low thermal
resistance of 5 – 6 × 10-6 m2·K/W.

KB 1458 TC has a wide serviceable temperature range of -70°C to
+150°C.
It adheres well to a wide variety of substrates including metals, ceramics,
composites, most plastics and glass. It provides superior bonding and
physical strength properties and very low shrinkage upon cure. In
addition,
it offers excellent dimensional stability and a very low coefficient of
thermal
expansion (CTE). Part A and Part B are gray in color. Owing to its
sensational thermal management properties KB 1458 TC is widely used in
electronics, optical and specialty OEM industries.

PRODUCT HIGHLIGHTS
Unrivaled heat transfer efficiency
Low coefficient of thermal expansion (CTE)
Superb mechanical strength properties
Microns thin bond lines achievable
Phenomenal electrical insulation properties
Unlimited working life at room temperature

TYPICAL APPLICATIONS
Bonding
Sealing

Industrial Certification : RoHS Compliant

Packaging : Cans, Pails