Kohesi Bond KB 1686 M is a two component, nickel filled epoxy system
suitable for
bonding, coating and sealing. It has a convenient 1:1 (Part A: Part B) mix
ratio by
weight or volume. Firstly, it offers very good electrical conductivity and
dimensional
stability. This epoxy system readily cures at room temperature and can
achieve
faster cures at elevated temperatures. The optimal cure schedule is an
overnight
room temperature set-up followed by a heat cure at 70°C – 90°C for 3 –
5 hours.

KB 1686 M offers a volume resistivity of 5 – 10 ohm-cm. It is ideal for
use in static
dissipation and EMI/RFI shielding applications. It offers an extensive
serviceable
temperature range of -50°C to +120°C. It is an outstanding adhesive
that offers
superb physical strength properties, allowing it to adhere well to a wide
variety of
substrates including metals, ceramics, most plastics and glass. In
addition to
superior electrical and thermal conductivity (1.3 – 1.4 W/m/K), it also
offers
astounding chemical resistance to various cleaning agents, oils and
water. Part A
and Part B are gray in color. It has a thixotropic paste like consistency
and a very
low coefficient of thermal expansion (CTE). Owing to its versatile
performance, KB
1686 M is widely used in electronics, aerospace, electrical,
semiconductor,
microwave and many OEM applications.

PRODUCT HIGHLIGHTS
Easy mix ratio of 1:1 by weight or volume
Outstanding dimensional stability
Superior thermal conductivity
High lap shear strength (> 2 100 psi)
Nickel filled
electrically conductive
100% solids system

TYPICAL APPLICATIONS
Bonding
Sealing
Coating

Industrial Certification : RoHS Compliant

Packaging : Cans, Jars