Kohesi Bond TUF 1621 AOHT is a two component, room temperature
curing epoxy system suitable for bonding and sealing. It is capable of
passing NASA standards for low outgassing (ASTM E-595) and has a
convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This
unique epoxy system offers remarkable toughness and superior peel
strength. It readily cures at room temperature and can achieve faster
cures at elevated temperatures. The optimal cure schedule is an
overnight room temperature set-up followed by a heat cure at 70°C –
90°C for 3 – 5 hours.

TUF 1621 AOHT is thermally conductive and it can withstand very high
temperatures. It offers an extensive serviceable temperature range of
-70°C to +200°C. This phenomenal adhesive fosters outstanding
resistance to mechanical and thermal shocks. It offers exceptionally high
lap shear strength (> 3,300 psi). TUF 1621 AOHT adheres well to a wide
variety of substrates including metals, ceramics, most plastics, rubbers
and glass. In addition to superior electrical insulation, it also offers very
good resistance to various chemicals, such as water, oils and fuels. Part A
and Part B are off-white in color. TUF 1621 AOHT is widely used in
electronic, optoelectronic, vacuum, aerospace and related industries.

PRODUCT HIGHLIGHTS
Superior thermal conductivity
Excellent toughness
Convenient 1:1 mix ratio
First-rate thermal conductivity
Exceptional electrical insulation properties
Capable of passing NASA low outgassing

TYPICAL APPLICATIONS
Bonding
Sealing
Coating

Industrial Certification : RoHS Compliant and NASA (Low Outgassing
ASTM E-595)

Packaging : Cans, Pails