Kohesi Bond TUF 1613 HT-SM is a true single component system that
requires no mixing and cures hard at elevated temperatures. Although it
requires a minimum temperature of 120°C for curing (at which it cures
extraordinarily fast), it can achieve even faster cures at higher
temperatures. TUF 1613 HT-SM offers an extensive serviceable
temperature range of -70°C to +180°C. This product can withstand
severe
thermal cycling and shocks. Being a one component system, it provides
ease of application and also adheres well to a wide variety of substrates
including metals, ceramics, composites, most plastics and glass. It
provides
outstanding bonding and physical strength properties, as well as
dimensional stability. TUF 1613 HT-SM is a 100% solids and a reactive
system i.e. it does not contain any solvents or diluents. In addition to
superior electrical insulation, TUF 1613 HT-SM also offers very good
thermal conductivity. It offers very smooth paste like consistency and
does
not tail when dispensed. It has a tan – brown color and it can be color
matched to your specifications. With an ideal dispensing profile, TUF 1613
HT-SM although most commonly used for surface mount applications, its
superior performance also makes it suitable for use in various other
electronics, aerospace and distinctive OEM applications.

PRODUCT HIGHLIGHTS
Thermally conductive
Low ionic content
Extremely fast cure
Outstanding dimensional stability
Superb electrical insulator
Unlimited working life at room temperature

TYPICAL APPLICATIONS
Surface Mount
Bonding
Sealing

Industrial Certification : RoHS Compliant

Packaging : Pails, Can, Syringes