Kohesi Bond KB 1613 RLV is a true single component system that
requires
no mixing and cures hard at elevated temperatures. Although it requires
a
minimum temperature of 120°C for curing (at which it cures
extraordinarily
fast), it can achieve even faster cures at elevated temperatures. KB 1613
RLV offers an extensive serviceable temperature range of -50°C to
+180°C. This product’s exquisite flow properties makes it ideal for use in
underfill, potting and encapsulation applications. Being a one component
system, it provides ease of application and also adheres well to an
encyclopedic variety of substrates including metals, ceramics, most
plastics
and glass. It provides sterling mechanical strength properties and
dimensional stability. KB 1613 RLV offers phenomenal thermal
conductivity
of 1 – 1.2 W/m/K. In addition to superior electrical insulation, KB 1613
RLV
also offers astounding chemical resistance to a variety of fuels, oils and
water. It has a light yellow color, but it can be color matched to your
specifications upon request. With a unique combination of remarkable
performance, ease of use and excellent mechanical strength properties,
KB
1613 RLV is widely used in electronics and microelectronics packaging
and
assembly applications.

PRODUCT HIGHLIGHTS
Thermally conductive
Castable up to 1 inch thicknesses
Rapid cures at elevated temperatures
Superior dimensional stability
Exceptional electrical isolator
Unlimited working life at room temperature

TYPICAL APPLICATIONS
Underfill
Potting
Encapsulation
Sealing
Coating

Industrial Certification : RoHS Compliant

Packaging : Cans, Pails, Syringes