Kohesi Bond TUF 1828 TC is a toughened, single component, thermal
management epoxy system that offers an unlimited working life at room
temperature. Firstly, this product offers phenomenal heat transfer
capabilities. This products has very low thermal resistance and can be
applied in layers as thin as 10 microns. The efficiency heat transfer
improves exceedingly with lower thermal resistance. This can be
explained
easily with the following formula: R = l/K [“R” is the thermal resistance;
“l”
is the adhesive layer thickness; “K” is the thermal conductivity of the
adhesive] Applying peculiar values, standard thermally conductive
adhesives (alumina filled) that are applicable in more than 50 micron
thicknesses, offer a thermal resistance of 35 – 40 × 10-6 m2·K/W. Since
TUF 1828 TC can be applied in 10 micron thick sections, it offers a
notably
low thermal resistance of 5 – 6 × 10-6 m2·K/W. TUF 1828 TC is
cryogenically serviceable. Being a one component system, it provides
ease
of application and also adheres well to a wide variety of substrates
including metals, ceramics, composites, most plastics and glass. It
provides
superior bonding and physical strength properties. It has a gray color.
Owing to its sensational thermal management properties and low
outgassing properties TUF 1828 TC is widely used in electronics, optical,
aerospace, specialty OEM and cryogenic industries.

PRODUCT HIGHLIGHTS
Unrivaled heat transfer efficiency
Cryogenically serviceable
Superb mechanical strength properties
Microns thin bond lines achievable
Capable of passing NASA low outgassing
Unlimited working life at room temperature

TYPICAL APPLICATIONS
Bonding
Sealing

Industrial Certification : RoHS Compliant and NASA (Low Outgassing
ASTM
E-595)

Packaging : Pails, Cans