Kohesi Bond KB 1689 is a two component, toughened, silver coated
nickel
filled epoxy system suitable for bonding and sealing. It has a convenient
1:1 (Part A: Part B) mix ratio by weight. Firstly, it offers very good
electrical conductivity and very low shrinkage upon cure. This epoxy
system readily cures at room temperature and can achieve faster cures at
elevated temperatures. The optimal cure schedule is an overnight room
temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5
hours.

KB 1689 can withstand severe thermal cycling and shocks even at
cryogenic temperatures. It offers an extensive serviceable temperature
range of 4K (-269.15°C) to +135°C. It is an outstanding adhesive that
offers superb bond strength, peel strength and toughness, allowing it to
bond dissimilar substrates with different coefficients of thermal
expansion.
KB 1689 adheres well to a wide variety of substrates including metals,
ceramics, most plastics and glass. In addition to superior electrical and
thermal conductivity (1.8 – 2.3 W/m/K), it also offers astounding
chemical
resistance to a variety of fuels, oils and water. Part A and Part B have a
gray color. Owing to its versatile performance, KB 1689 is widely used in
electronics, aerospace, electrical, semiconductor, microwave and various
OEM applications.

PRODUCT HIGHLIGHTS
Easy mix ratio of 1:1 by weight
Outstanding toughness
Superior thermal conductivity
Cost effective
Very low volume resistivity (< 0.005 ohm-cm)
Cryogenically serviceable

TYPICAL APPLICATIONS
Bonding
Sealing

Industrial Certification : RoHS Compliant

Packaging : Cans, Jars