Kohesi Bond KB 1031 AT-S is a two component,
silver filled, electrically conductive epoxy system
suitable for bonding and sealing. It has a
convenient 1:1 (Part A: Part B) mix ratio by weight.
It offers unprecedentedly low volume resistivity (<
10-3 ohm-cm) and remarkably high thermal
conductivity. This epoxy system readily cures at
room temperature and can achieve faster cures at
elevated temperatures. The optimal cure schedule
is an overnight room temperature set-up followed
by a heat cure at 70°C - 90°C for 3 - 5 hours.

KB 1031 AT-S can withstand severe thermal
cycling, shocks and vibrations even at cryogenic
temperatures. It offers an extensive serviceable
temperature range of 4K (-269.15°C) to +135°C. It
is a phenomenal adhesive offering outstanding
physical strength properties and peel strength. KB
1031 AT-S adheres well to a wide variety of
substrates including metals, ceramics, most plastics
and glass. In addition, it also offers astounding
chemical resistance to a variety of fuels, oils and
water. Part A and Part B have a silver – gray color.
KB 1031 AT-S can be applied with minimal
dripping; however it can be made more flowable by
adding 5 – 10% of solvent like acetone or xylene.
KB 1031 AT-S is widely used in electronics,
microwave, aerospace, semiconductor among
various industries.

PRODUCT HIGHLIGHTS
High purity silver conductive
Tremendous toughness
Cryogenically serviceable
Exceptional peel strength
Superior thermal conductivity
Withstands severe shocks

TYPICAL APPLICATIONS
Bonding
Sealing
Coating

Industrial Certification : RoHS Compliant

Packaging : Cans, Jars