Kohesi Bond TUF 1613 HT-DA is a fast curing, true single component
epoxy
system for die attach applications. Unlike other die attach systems, TUF
1613 HT-DA is not a premixed and frozen system. It only needs
elementary refrigeration for storage and offers an unlimited working life
at
room temperature. It cures exceptionally fast in 5 – 10 minutes at 150°C.
TUF 1613 HT-DA dispenses ideally leaving no tail behind and can be
easily
used with automated dispensing equipment. It offers an extensive
serviceable temperature range of -70°C to +200°C. It adheres well to a
broad variety of substrates including metals, ceramics, most plastics and
glass. It provides outstanding die shear strength and is capable of
passing
NASA low outgassing test specifications. TUF 1613 HT-DA offers
phenomenal thermal conductivity of 1.4 – 1.5 W/m/K. It has the
capability
to withstand ard-uous thermal cycling. In addition to superior electrical
insulation, TUF 1613 HT-DA also offers less than 1% weight change after
rigorous 168 hours of 85°C/85% RH test. It has a standard light yellow –
tan color. This perfect combination of remarkable performance, ease of
use, incomparable die shear strength and dimensional stability makes
TUF
1613 HT-DA a guru for die attach applications.

PRODUCT HIGHLIGHTS
Remarkable die shear strength
Ultimate dispensing profile
Thermally conductive
Low ionic content (chlorine < 15 ppm)
Capable of passing NASA low outgassing
Unlimited working life at room temperature

TYPICAL APPLICATIONS
Die Attach
Bonding
Sealing

Industrial Certification : RoHS Compliant and NASA (Low Outgassing
ASTM
E-595)

Packaging : Cans, Pails, Syringes